Remote areas: Static models are usually situated remotely, expanding Price and decreasing Over-all process efficiency.
30% of its peak power intake, giving our clients significant reduction in operating fees and enhanced trustworthiness.
Using the POU3500, you may obtain unparalleled results in etch performance, chamber uptime, lessened price of ownership and fab House utilization – all while enhancing your course of action reliability.
initially Started in 1985, our company has grown right into a recognized chief in offering temperature Regulate systems to the global semiconductor industry.
LAUDA-Noah will, for a purchaser's retrofit analysis, monitor and modify its fluid temperature Command profiles to match an current TCUs' to be able to ensure a smooth process integration via DAQ.
The precision from the POU 3300 permits impartial Charge of the process fluid temperature on the wafer chuck in +/- 0.one °C of established place, as well as speedy reaction time on the process makes it possible for for maximum wafer-to-wafer repeatability all over the etch approach.
The accuracy of the POU 3500 allows for unbiased control of the procedure fluid temperature to your wafer chuck inside +/- 0.1 °C of set stage, plus the fast response time of your system will allow for optimum wafer-to-wafer repeatability all through the etch method.
With the POU3300, you may accomplish unprecedented brings about etch efficiency, chamber uptime, lessened expense of ownership and fab House utilization – all while increasing your method trustworthiness.
the information pertains to your 300mm chamber temperature profile through a higher component ratio Etch process, functioning at quite high RF electric power problems (~three.8kW). The powerful facets of this data established are:
Dynamic Temperature Control, as executed in techniques such as the LAUDA-Noah check here POU, is undoubtedly an solution that senses the temperature of the procedure fluid returning from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature from the equipped method fluid depending on this real-time feed-back.
The data established Here's from the 200mm quantity production wafer fab and Plainly illustrates the good thing about the LAUDA-Noah POU process.
The POU3300 program gives dynamic temperature control of the procedure chamber cathode / electrode / anode and may be synchronized with any etch procedure.
Confirmed; TEs' represent just one Component of a chiller's structure. The switching & Regulate techniques used by a chiller will affect the TEs' dependability.
(Therefore, setting up a static unit next to chamber will likely not empower it to deliver dynamic temperature Management)
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